30g Silver Thermal Paste Compound

Enhance your system’s cooling performance with the 30g Silver Thermal Paste Compound, a silicone-based thermal interface material designed for effective heat transfer between CPUs, GPUs, and heatsinks. This paste ensures stable temperatures and prevents overheating, keeping your electronics running at optimal performance levels.

Key Features:

• High Thermal Conductivity: >1.96 W/m·K for efficient heat transfer between components and heatsinks.

• Low Thermal Resistance: <0.225 °C·in²/W for reduced temperature buildup and improved cooling.

• Reliable & Durable: Non-drying and non-corrosive formula maintains consistent performance over time.

• Safe & Non-Conductive: Electrical insulation ensures safety when applied near sensitive electronic parts.

• Easy Application: Smooth texture allows for even spreading and effortless cleanup.

• Universal Use: Suitable for CPUs, GPUs, LEDs, transistors, power modules, and other heat-sensitive components.

Technical Specifications:

• Product Type: Silver Thermal Paste Compound

• Net Weight: 30 g

• Thermal Conductivity: > 1.96 W/m·K

• Thermal Resistance: < 0.225 °C·in²/W

• Operating Temperature Range: –50 °C to +200 °C

• Color: Silver-grey

• Base Material: Silicone compound with metal oxide

• Shelf Life: 3 years (sealed, stored below 25 °C)

Applications:
Ideal for computer processors, graphics cards, LED lighting, amplifiers, and other electronic devices requiring efficient heat dissipation.